Structural Analysis Software(erp) - List of Manufacturers, Suppliers, Companies and Products

Structural Analysis Software Product List

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Introduction to a top-class finite element solver.

A solution that incorporates high reliability, proven results, and the latest analytical technologies abundantly.

NASTRAN is an analysis program born from space programs where failure is not an option, and for over 40 years, it has maintained high reliability and a proven track record in meeting the stringent demands of various fields such as aerospace/defense, construction, automotive, shipbuilding, machinery, and electrical/electronics. NX Nastran inherits this high reliability and proven performance while incorporating the latest analysis technologies, making it a suitable solution for the 21st century. 【Features】 - Supports large-scale problems and advanced nonlinear analysis - Flexible selection of the number of implementations based on analysis content - Operates on multiple operating systems including Windows, UNIX, and Linux - Supports 64-bit modules, memory-sharing parallel processing, and parallel processing on cluster machines 【Available Analyses】 - Linear static analysis: SOL101 - Eigenvalue analysis: SOL103 - Buckling analysis: SOL105 - Steady-state heat conduction analysis: SOL153 - Transient heat conduction analysis: SOL159 - Linear transient analysis: SOL109/112 - Frequency response analysis: SOL108/111 - Response spectrum analysis: SOL109/112, etc. *There are many other diverse modules available, so please contact us for more detailed information.

  • Scientific Calculation and Simulation Software

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CAE Technology Research Conference 2016 (Free Participation Fee)

The keynote speech will feature hot topics on the science of sports and presentations on fire simulation research.

CAE Utilization Technology Research Conference 2016 "Let's Talk about CAE in Kudanshita!" / "6th DADiSP Utilization Technology Research Conference" The CAE Utilization Technology Research Conference is celebrating its 6th year since the DADiSP Utilization Technology Research Conference. We have many user case studies planned. This event is packed with useful and up-to-date information on cloud CAE, composite materials, optimization, and more, which you won't hear elsewhere. ============================= ● Date and Time: August 5, 2016 (Friday) 10:00 AM - 5:30 PM (Networking event from 5:30 PM) ● Capacity: 80 participants ● Venue: Hotel Grand Palace 1-1-1 Iidabashi, Chiyoda-ku, Tokyo (• 1-minute walk from Kudanshita Station on the Tokyo Metro Tozai Line, Exit 7 (Fujimi Exit)) ● Registration: http://www.cae-sc.com/events/cae-conf-2016.html ■ Organized by: CAE Solutions Co., Ltd.

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